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| MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MPX4101A/D Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated The Motorola MPX4101A/MPXA4101A/MPXH6101A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The small form factor and high reliability of on-chip integration makes the Motorola MAP sensor a logical and economical choice for automotive system designers. The MPX4101A/MPXA4101A/MPXH6101A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Features * 1.72% Maximum Error Over 0 to 85C * Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems * Temperature Compensated Over -40C to +125C * Durable Epoxy Unibody Element or Thermoplastic (PPS) Surface Mount Package Application Examples * Manifold Sensing for Automotive Systems * Ideally Suited for Microprocessor or Microcontroller-Based Systems * Also Ideal for Non-Automotive Applications SUPER SMALL OUTLINE PACKAGE VS MPX4101A MPXA4101A MPXH6101A SERIES INTEGRATED PRESSURE SENSOR 15 to 102 kPa (2.18 to 14.8 psi) 0.25 to 4.95 V Output SMALL OUTLINE PACKAGE MPXA4101AC6U CASE 482A PIN NUMBER 1 2 3 4 N/C VS Gnd Vout 5 6 7 8 N/C N/C N/C N/C NOTE: Pins 1, 5, 6, 7, and 8 are not device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. UNIBODY PACKAGE SENSING ELEMENT THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY MPXH6101A6T1 CASE 1317 Vout MPX4101A CASE 867 PIN NUMBER 1 N/C VS Gnd Vout 5 6 7 8 N/C N/C N/C N/C 1 2 3 2 3 4 PIN NUMBER Vout Gnd VS 4 5 6 N/C N/C N/C PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS FOR SMALL OUTLINE DEVICE GND PINS 4, 5 AND 6 ARE NO CONNECTS FOR UNIBODY DEVICE Figure 1. Fully Integrated Pressure Sensor Schematic NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is denoted by the chamfered corner of the package. NOTE: Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. REV 4 Motorola Sensor (c) Motorola, Inc. 2002 Device Data MPX4101A MPXA4101A MPXH6101A SERIES 1 MAXIMUM RATINGS(NOTE) Parametric Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 400 -40 to +125 -40 to +125 Unit kPa C C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Pressure Supply Range(1) Symbol POP VS Io (0 to 85C) (0 to 85C) (0 to 85C) (0 to 85C) Voff VFSO VFSS -- V/P tR Io+ -- -- Min 15 4.85 -- 0.171 4.870 -- -- -- -- -- -- -- Typ -- 5.1 7.0 0.252 4.951 4.7 -- 54 15 0.1 20 0.5 Max 102 5.35 10 0.333 5.032 -- 1.72 -- -- -- -- -- Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa ms mAdc ms %VFSS Voltage(2) Supply Current Minimum Pressure Offset(3) @ VS = 5.1 Volts Full Scale Output(4) @ VS = 5.1 Volts Full Scale Span(5) @ VS = 5.1 Volts Accuracy(6) Sensitivity Response Time(7) Output Source Current at Full Scale Output Warm-Up Offset Time(8) Stability(9) NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX4101A MPXA4101A MPXH6101A SERIES 2 Motorola Sensor Device Data FLUORO SILICONE GEL DIE COAT P1 WIRE BOND LEAD FRAME DIE STAINLESS STEEL CAP THERMOPLASTIC CASE ABSOLUTE ELEMENT SEALED VACUUM REFERENCE DIE BOND Figure 2. Cross Sectional Diagram SSOP (not to scale) Figure 2 illustrates an absolute sensing chip in the super small outline package (Case 1317). 5.0 +5.1 V VS Pin 2 100 nF MPXH6101A Vout Pin 4 GND Pin 3 47 pF 51 K to ADC OUTPUT (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 TRANSFER FUNCTION: Vout = Vs* (PX0.01059*P-0.10941) Error VS = 5.1 Vdc TEMP = 0 to 85C MAX 20 kPa TO 105 kPa MPX4101A TYP MIN Figure 3. Recommended power supply decoupling and output filtering. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C. The output will saturate outside of the specified pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4101A/MPXA4101A/MPXH6101A series pressure sensor operating characteristics, and internal reliability and qual- ification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Motorola Sensor Device Data 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 Pressure (ref: to sealed vacuum) in kPa Figure 4. Output versus Absolute Pressure MPX4101A MPXA4101A MPXH6101A SERIES 3 Transfer Function (MPX4101A, MPXA4101A, MPXH6101A) Nominal Transfer Value: Vout = VS (P x 0.01059 - 0.10941) +/- (Pressure Error x Temp. Factor x 0.01059 x VS) VS = 5.1 V 0.25 Vdc Temperature Error Band MPX4101A, MPXA4101A, MPXH6101A Series 4.0 3.0 2.0 1.0 0.0 Temp - 40 0 to 85 +125 Multiplier 3 1 3 Temperature Error Factor -40 -20 0 20 40 60 80 100 120 140 Temperature in C NOTE: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 125C. Pressure Error Band 3.0 Pressure Error (kPa) 2.0 1.0 0.0 -1.0 - 2.0 - 3.0 Pressure 15 to 102 (kPa) Error (Max) 1.5 (kPa) 0 15 30 45 60 75 90 105 120 Pressure (in kPa) Error Limits for Pressure MPX4101A MPXA4101A MPXH6101A SERIES 4 Motorola Sensor Device Data PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Motorola pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Stainless Steel Cap Side with Port Attached Stainless Steel Cap Stainless Steel Cap Part Number MPX4101A MPXA4101AC6U MPXH6101A6U MPXH6101A6T1 Case Type 867 482A 1317 1317 ORDERING INFORMATION -- UNIBODY PACKAGE The MPX4101A series MAP silicon pressure sensors are available in the Basic Element, or with pressure port fittings that provide mounting ease and barbed hose connections. MPX Series Device Type Basic Element Options Absolute, Element Only Case Type 867 Order Number MPX4101A Device Marking MPX4101A ORDERING INFORMATION -- SMALL OUTLINE PACKAGE Device Type Ported Element Options Absolute, Axial Port Case No. 482A MPX Series Order No. MPXA4101AC6U Packing Options Rails Marking MPXA4101A ORDERING INFORMATION -- SUPER SMALL OUTLINE PACKAGE Device Type Basic Element Basic Element Options Absolute, Element Only Absolute, Element Only Case No. 1317 1317 MPX Series Order No. MPXH6101A6U MPXH6101A6T1 Packing Options Rails Tape and Reel Marking MPXH6101A MPXH6101A INFORMATION FOR USING THE SMALL OUTLINE PACKAGES MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct 0.100 TYP 8X 2.54 footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.050 1.27 TYP 0.150 3.81 0.387 9.83 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.027 TYP 8X 0.69 0.100 TYP 8X 2.54 inch mm SCALE 2:1 0.053 TYP 8X 1.35 inch mm Figure 5. SOP Footprint (Case 482) Figure 6. SSOP Footprint (Case 1317) Motorola Sensor Device Data MPX4101A MPXA4101A MPXH6101A SERIES 5 UNIBODY PACKAGE DIMENSIONS C R M B -A- N PIN 1 SEATING PLANE 1 2 3 4 5 6 POSITIVE PRESSURE (P1) NOTES: 10. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 11. CONTROLLING DIMENSION: INCH. 12. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _NOM 0.475 0.495 0.430 0.450 0.090 0.105 MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _NOM 12.07 12.57 10.92 11.43 2.29 2.66 L -T- G F D 6 PL 0.136 (0.005) M J S TA M STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX STYLE 2: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN STYLE 3: PIN 1. 2. 3. 4. 5. 6. CASE 867-08 ISSUE N BASIC ELEMENT SMALL OUTLINE PACKAGE DIMENSIONS -A- 5 4 D 8 PL 0.25 (0.010) M TB S A S N -B- 8 G 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 S W V C H J K M PIN 1 IDENTIFIER -T- SEATING PLANE CASE 482A-01 ISSUE A MPX4101A MPXA4101A MPXH6101A SERIES 6 Motorola Sensor Device Data SUPER SMALL OUTLINE PACKAGE DIMENSIONS 2X 0.006 C A B 0.420 0.400 0.050 0.025 0.300 0.280 3 0.019 5 0.014 M CAB 0.004 8X NOTES: 1. ALL DIMENSIONS ARE IN INCHES. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006 INCHES PER SIDE. 4. ALL VERTICAL SURFACES TO BE 5 MAXIMUM. 5. DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 INCHES MAXIMUM. A B 3 0.300 0.280 0.298 0.278 .010 GAGE PLANE 0.165 0.145 0.010 0.002 0.004 DETAIL E C SEATING PLANE 0.023 0.013 DETAIL E 10 0 CASE 1317-03 ISSUE B Motorola Sensor Device Data MPX4101A MPXA4101A MPXH6101A SERIES 7 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and the Stylized M Logo are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Motorola and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. E Motorola, Inc. 2002. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1-303-675-2140 or 1-800-441-2447 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3-20-1, Minami-Azabu. Minato-ku, Tokyo 106-8573 Japan. 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852-26668334 Technical Information Center: 1-800-521-6274 HOME PAGE: http://www.motorola.com/semiconductors/ MPX4101A MPXA4101A MPXH6101A SERIES 8 Motorola Sensor Device Data MPX4101A/D |
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